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    ECM 麦克风

    MEMS 麦克风

    特种麦克风

    IA 麦克风

    加速度传感器

    语音振动传感器

    声学阻尼器

    防耳垢滤网

    感应线圈

    编程配件

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    麦克风模组

    RIC 模组

    ProxFusion 多功能传感器

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    ProxSense 电容式传感器

    ProxSense 模组

    ProxSense 评估套件

    神经决策处理器

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NCH-RSL10-101S51-ACG

NCH-RSL10-101S51-ACG

Home / Products / Wireless Systems / Bluetooth Modules / NCH-RSL10-101S51-ACG
RSL10 BlueTooth Low-Energy (BLE) radio. SIP module. RoHS
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onsemi logo
onsemi is a pioneer in the development of miniaturized packaging solutions for the medical microelectronics industry. They offer an array of technologies for medical applications where size, performance, and system integration are critical. They have proven leadership in this field, addressing the highly space-constrained requirements of Hearing Aid manufacturers.

Characteristics

Additional information

Product status

Preferred

Description

Chipset RSL10 BLE RADIO SIP MODULE

Diameter / length [mm]

8

Width [mm]

6.00

Thickness [mm]

1.46

Package

SIP-51

RF Protocol

Bluetooth v5.0

Memory [MB]

384kB Flash memory

Frenquency Band [MHz]

2400-2480

Digital Comm I/O

I²C. SPI. UART

Min. operating Temp. [°C]

-40

Max. operating Temp. [°C]

85

MSL level

3

Bluetooth 5.2
System-in-Package (SiP)
RSL10 SIP

  • Ultra-Low-Power
  • Advanced Multi-Protocol Wireless Functionality
  • Flexible Voltage Supply Range (1.1 and 3.3 V)
  • Ultra-Miniature
  • Sophisticated Dual-Core Architecture
  • On-Chip and Software Wireless Support
  • Highly-Integrated System-on-Chip (SoC)
  • Other Key Technical Features:
    • 384 kB of flash memory
    • IP protection feature to secure flash contents
    • Configurable analog and digital sensor interfaces (GPIOs. LSADs. I2C. SPI. PCM)

  • IoT Edge-Node Applications
  • Wearables
  • Energy Harvesting
  • Automotive Applications

Datasheet

NCH-RSL10-101S51-ACG

Home / Products / Wireless Systems / Bluetooth Modules / NCH-RSL10-101S51-ACG
NCH-RSL10-101S51-ACG
RSL10 BlueTooth Low-Energy (BLE) radio. SIP module. RoHS

Additional information

Product status

Preferred

Description

Chipset RSL10 BLE RADIO SIP MODULE

Diameter / length [mm]

8

Width [mm]

6.00

Thickness [mm]

1.46

Package

SIP-51

RF Protocol

Bluetooth v5.0

Memory [MB]

384kB Flash memory

Frenquency Band [MHz]

2400-2480

Digital Comm I/O

I²C. SPI. UART

Min. operating Temp. [°C]

-40

Max. operating Temp. [°C]

85

MSL level

3

Ask us about this product
Claim Free Samples

Bluetooth 5.2
System-in-Package (SiP)
RSL10 SIP

  • Ultra-Low-Power
  • Advanced Multi-Protocol Wireless Functionality
  • Flexible Voltage Supply Range (1.1 and 3.3 V)
  • Ultra-Miniature
  • Sophisticated Dual-Core Architecture
  • On-Chip and Software Wireless Support
  • Highly-Integrated System-on-Chip (SoC)
  • Other Key Technical Features:
    • 384 kB of flash memory
    • IP protection feature to secure flash contents
    • Configurable analog and digital sensor interfaces (GPIOs. LSADs. I2C. SPI. PCM)

  • IoT Edge-Node Applications
  • Wearables
  • Energy Harvesting
  • Automotive Applications

Datasheet
onsemi logo
onsemi is a pioneer in the development of miniaturized packaging solutions for the medical microelectronics industry. They offer an array of technologies for medical applications where size, performance, and system integration are critical. They have proven leadership in this field, addressing the highly space-constrained requirements of Hearing Aid manufacturers.
NCH-RSL10-101S51-ACG

Characteristics

Additional information

Product status

Preferred

Description

Chipset RSL10 BLE RADIO SIP MODULE

Diameter / length [mm]

8

Width [mm]

6.00

Thickness [mm]

1.46

Package

SIP-51

RF Protocol

Bluetooth v5.0

Memory [MB]

384kB Flash memory

Frenquency Band [MHz]

2400-2480

Digital Comm I/O

I²C. SPI. UART

Min. operating Temp. [°C]

-40

Max. operating Temp. [°C]

85

MSL level

3

NCH-RSL10-101S51-ACG

Home / Products / Wireless Systems / Bluetooth Modules / NCH-RSL10-101S51-ACG
RSL10 BlueTooth Low-Energy (BLE) radio. SIP module. RoHS
Ask us about this product
Claim Free Samples

Bluetooth 5.2
System-in-Package (SiP)
RSL10 SIP

  • Ultra-Low-Power
  • Advanced Multi-Protocol Wireless Functionality
  • Flexible Voltage Supply Range (1.1 and 3.3 V)
  • Ultra-Miniature
  • Sophisticated Dual-Core Architecture
  • On-Chip and Software Wireless Support
  • Highly-Integrated System-on-Chip (SoC)
  • Other Key Technical Features:
    • 384 kB of flash memory
    • IP protection feature to secure flash contents
    • Configurable analog and digital sensor interfaces (GPIOs. LSADs. I2C. SPI. PCM)

  • IoT Edge-Node Applications
  • Wearables
  • Energy Harvesting
  • Automotive Applications

Datasheet
onsemi logo
onsemi is a pioneer in the development of miniaturized packaging solutions for the medical microelectronics industry. They offer an array of technologies for medical applications where size, performance, and system integration are critical. They have proven leadership in this field, addressing the highly space-constrained requirements of Hearing Aid manufacturers.

南京赛泰商贸有限公司

江苏省南京市鼓楼区南昌路40号长江科技园大厦2001

Tel EU : +33 1 48 92 90 02
Tel USA : +1 (919) 481 6896
Tel CN: +86 25 83 45 54 33

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NCH-RSL10-101S51-ACG

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